Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Ravich Joshua
9781032160856
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| Author(s) :- Ravich Joshua | Format :- Paperback |
| Publisher :- Taylor & Francis Ltd | Pub. Date :- 2024-08-26 |
| ISBN-13 :- 9781032160856 | |
| Series:- Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems | |
| Pagination :- 290 pages, 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and w | |
| Dimensions :- 233 x 157 x 21 | |
| Weight :- 470 |
Description
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
