ISTFA 2021
ASM International
9781627084192
onload="displayBookAvailableStatusC()"/>
Rating:
Rs. 121100.00
Delivery in 25 - 45 working days
Covid-19 Notice
Due to the current situation the Delivey will be delayed than the standard shipping period (21 working days)
Call our hotline 011 7 463 463
Additional Information
Add to wishlist
| Author(s) :- ASM International | Format :- Paperback |
| Publisher :- A S M International | Pub. Date :- 2022-07-30 |
| ISBN-13 :- 9781627084192 | |
| Pagination :- 461 pages | |
| Dimensions :- 231 x 286 x 31 | |
| Weight :- 1150 |
Description
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
