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Author(s) :- Thiele Matthias | Format :- Hardback |
Publisher :- Springer International Publishing AG | Pub. Date :- 2018-05-11 |
ISBN-13 :- 9783319735573 | |
Edition:- 1st ed. 2018 | |
Pagination :- 159 pages, 95 Illustrations, color; 4 Illustrations, black and white; XIII, 159 p. 99 illus., 95 ill | |
Dimensions :- 235 x 155 | |
Weight :- 432 |
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration.